| 1. | Specification for adhesives in hybrid microcircuits
混合微电路用胶粘剂规范 |
| 2. | Test method for hermeticity of hybrid microcircuit packages prior to lidding
混合微电路组件在封装前的密封性的试验方法 |
| 3. | Hybrid microcircuits . film deposit resistive integrated circuits . general requirements
混合微电路.薄膜附着电阻集成电路.一般要求 |
| 4. | Test method for combined fine and gross leaks for large hybrid microcircuit packages
大型混合微电路插件的综合微泄漏和总泄漏的试验方法 |
| 5. | Detail specification for hybrid microcircuits hsh91 precision dual sample hold amplifier
混合微电路详细规范hsh91型精密双采样保持放大器 |
| 6. | Detail specification for hybrid microcircuits hsh4860 high speed , precision sample hold amplifier
混合微电路详细规范hsh4860型高速精密采样保持放大器 |
